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Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

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Electroless Copper Plating Process for Multilayer Boards

　　　　Electroless copper plating is a pivotal process in the fabrication of multilayer printed circuit boards (PCBs), enabling the formation of conductive pathways without the need for an external electric current. This technique is based on a chemical reduction reaction, where copper ions in the plat

Jun 24, 2025 1

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Detailed Explanation of the Backdrill Process for Double-Sided PCBs

　　　　The backdrill process is an important technique used in the manufacturing of double-sided PCBs to improve signal integrity and reduce electrical losses. In a double-sided PCB, when vias are drilled through the board to connect the top and bottom layers, the unused portion of the via barrel (the

Jun 23, 2025 1

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Ethernet Interface Circuit Design for Double-Sided PCBs

　　　　Designing an Ethernet interface circuit on a double-sided PCB requires careful consideration of various factors to ensure reliable data transmission and optimal performance. Ethernet interfaces are widely used in a variety of electronic devices for network connectivity, and the PCB design plays

Jun 23, 2025 1

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Application of Double-Sided PCBs in Smart Socket Circuits

　　　　Double-sided PCBs play a vital role in the design and functionality of smart socket circuits. Smart sockets are becoming increasingly popular due to their ability to monitor and control electrical devices remotely, providing users with convenience, energy efficiency, and enhanced safety.　　In a s

Jun 23, 2025 1

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Double-Sided PCB Board Vias Cover Oil Process

　　　　The vias cover oil process in double-sided printed circuit boards (PCBs) is a crucial manufacturing technique that significantly impacts the performance, reliability, and lifespan of the PCB. In double-sided PCBs, vias are holes that connect the components and traces on the top and bottom layers

Jun 23, 2025 1

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Optimization of High - Temperature Processes for FPC Boards

　　　　Flexible Printed Circuit (FPC) boards have become indispensable in modern electronics due to their flexibility and compact design. However, the high - temperature processes involved in their manufacturing, such as soldering, reflow soldering, and curing of adhesives, can pose significant challen

Jun 19, 2025 1

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