Shenzhen Chengchi Circuit Technology Co., Ltd. specializes in the technical research and development, design, processing, assembly, and SMT (Surface Mount Technology) stencil production for electronic products. We primarily offer surface mount (SMT) processing, chip processing, automated through-hole (AIM) insertion, PCBA assembly (DIP), as well as OEM processing, ODM, and EMS contract manufacturing services for various electronic products. We possess strong supporting processing and production capabilities.

Component specifications for processing include: LGA, CSP, BGA, QFP, TQFP, QFN, PLCC, SOT, SOIC, 1206, 0805, 0603, 0402, 0201.

Processing modes include: PCB soldering, lead-free SMT chip processing, through-hole processing, SMD chip, BGA soldering, BGA reballing, BGA processing, and chip packaging.

Product experience covers industrial, consumer, medical, digital, network communication, and computer peripherals. Examples include: mobile phone motherboards, pager boards, DVD, MP3, computer motherboards, laptop motherboards, network equipment cards, instrument control boards, switches, routers, set-top boxes, digital cameras, printers, radios, and all electronic high-tech product boards and assembly for industries such as industrial, communication, medical, digital, consumer, and computer peripherals.

Business scope:

Through-hole processing of plug-in materials (simple plug-in soldering).

Single-sided chip assembly (all surface-mounted components on one side of the PCB).

Double-sided chip assembly (surface-mounted components on both sides of the PCB, A and B).

Single-sided mixed assembly (both plug-in and surface-mounted components on the A side of the PCB).

Double-sided mixed assembly (plug-in and surface-mounted components on both the A and B sides of the PCB).

SMT processing services include:

Rapid sample SMT processing: For incoming sample SMT processing in the R&D stage, individual BGA sample soldering, and complete SMT processing; generally delivered within 1 day (delivery time depends on the complexity of the circuit board).

Small batch SMT processing: After completing product development and preparing for mass production, the first trial production involves sample SMT processing and incoming production for quantities around 101 to 1000 units; includes individual BGA sample soldering and complete SMT processing; generally delivered within 3 to 5 working days (delivery time depends on the complexity of the circuit board).

Medium batch production SMT processing: For products with a relatively small batch size that require rapid production completion, each batch quantity ranges from 1001 to 5000 units; we offer fast production speed for sample production, including individual BGA sample soldering and complete SMT processing; generally delivered within 5-7 working days (delivery time depends on the complexity of the circuit board).

SMT processing service process: [Process details not provided in the original text.]