
Dec 03, 2025
1
With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

Electromagnetic Compatibility (EMC) is one of the key indicators for evaluating the performance of 16-layer high-layer-count PCBs. For 16-layer boards integrated with a large number of high-speed chips and complex power modules, electromagnetic interference (EMI) not only affects their own signal tr
Jan 08, 2026
1

With the popularization of free prototyping services for high-layer-count PCBs (6 layers and above), the corresponding process specifications are also being continuously improved. High-layer-count boards have complex structures and high process difficulty. Their free fabrication specifications not o
Jan 07, 2026
1

During the PCB design process, the placement of the crystal oscillator is a detail that is often overlooked yet critically important. Many may wonder: Is it acceptable to place the crystal oscillator near the edge of the PCB board? Next, we will delve into this issue through a practical case study,
Jan 06, 2026
1

How to choose the number of channels for a PCB stress tester?The number of channels in a PCB stress tester determines the number of strain gauges it can monitor simultaneously. Different channel counts correspond to distinct testing scenarios. Making a reasonable choice regarding the number of chann
Jan 05, 2026
1

With breakthroughs in high-frequency signal processing technology, the third-generation low-power ultrasonic power supply PCB has achieved a qualitative leap in circuit optimization. Engineers adopted a four-layer blind and buried via design, implementing three-dimensional isolation between power an
Jan 04, 2026
1

In PCB design, the four-wire power interface combined with Kelvin connection (also known as four-terminal connection) is a core technique for achieving high-precision power supply or current/voltage measurement. Its primary purpose is to eliminate voltage errors caused by wire resistance and contact
Jan 03, 2026
1
