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Visit from American partners

Visit from American partners

Visit from American partnersDec 03, 2025 Visit from American partners1

With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

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Application Scenarios and Pitfall Guide for White, Red, and Blue Solder Masks

Application Scenarios and Pitfall Guide for White, Red, and Blue Solder Masks

Beyond the classic green and black, colored solder masks—white, red, blue, and others—are increasingly common in various products. White PCBs are widely used in LED lighting; red is often seen on development boards and high-voltage warning labels; and blue is prevalent in certain industrial control

Application Scenarios and Pitfall Guide for White, Red, and Blue Solder MasksAug 15, 2026 Application Scenarios and Pitfall Guide for White, Red, and Blue Solder Masks166

DetailApplication Scenarios and Pitfall Guide for White, Red, and Blue Solder Masks

Key Points for Manufacturing AI Server PCBs

Key Points for Manufacturing AI Server PCBs

AI server PCBs are high-end products governed by IPC‑6012 Class 3. Their fabrication process is complex, involving special processes such as high-layer-count lamination, back drilling, HDI, low-loss material machining, VLP copper foil, and resin-filled vias. In many projects, simulation, schematics,

Key Points for Manufacturing AI Server PCBsAug 14, 2026 Key Points for Manufacturing AI Server PCBs190

DetailKey Points for Manufacturing AI Server PCBs

A Comprehensive Analysis of PCB Stack-Up and Via Design for AI Servers

A Comprehensive Analysis of PCB Stack-Up and Via Design for AI Servers

In AI server 24–36 layer high-multilayer PCBs, stack-up planning is no longer merely about allocating signal and power layers; it is a comprehensive design endeavor involving signal integrity (SI), power integrity (PI), lamination processes, board thickness aspect ratios, and back-drilling technique

A Comprehensive Analysis of PCB Stack-Up and Via Design for AI ServersAug 13, 2026 A Comprehensive Analysis of PCB Stack-Up and Via Design for AI Servers145

DetailA Comprehensive Analysis of PCB Stack-Up and Via Design for AI Servers

Thermal Management and EMC Co-Design: PCB Protection Process Requirements for High-Density Optical Modules

Thermal Management and EMC Co-Design: PCB Protection Process Requirements for High-Density Optical Modules

The enclosures of 800G optical modules are compact and sealed, featuring high thermal density in DSPs and laser driver chips, coupled with strong electromagnetic radiation from high-frequency channels. Optimizing trace routing alone is insufficient to address issues such as thermal throttling and EM

Thermal Management and EMC Co-Design: PCB Protection Process Requirements for High-Density Optical ModulesAug 12, 2026 Thermal Management and EMC Co-Design: PCB Protection Process Requirements for High-Density Optical Modules394

DetailThermal Management and EMC Co-Design: PCB Protection Process Requirements for High-Density Optical Modules

First-Round Closed-Loop Verification: Schematics, Footprint Libraries, and Mechanical Constraints

First-Round Closed-Loop Verification: Schematics, Footprint Libraries, and Mechanical Constraints

The root cause of most post-design PCB rework lies in oversights during the pre-design data preparation phase. This initial front-end review acts as a safeguard, intercepting potential risks before layout and routing begin. Many engineers import the netlist and jump straight into routing, neglecting

First-Round Closed-Loop Verification: Schematics, Footprint Libraries, and Mechanical ConstraintsAug 11, 2026 First-Round Closed-Loop Verification: Schematics, Footprint Libraries, and Mechanical Constraints170

DetailFirst-Round Closed-Loop Verification: Schematics, Footprint Libraries, and Mechanical Constraints

Why Your PCB Impedance Calculation Is Correct, but the Board Still Fails Testing

Why Your PCB Impedance Calculation Is Correct, but the Board Still Fails Testing

"I calculated the trace width for exactly 50Ω, but the fabricated board measures 46Ω." Many engineers blame "poor manufacturing quality" for this discrepancy. However, the real culprit is often overlooking the "hidden variables" in materials and fabrication processes.Why Is Impedance Control So Diff

Why Your PCB Impedance Calculation Is Correct, but the Board Still Fails TestingAug 10, 2026 Why Your PCB Impedance Calculation Is Correct, but the Board Still Fails Testing554

DetailWhy Your PCB Impedance Calculation Is Correct, but the Board Still Fails Testing
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