The Thermal Conductive Ceramic PCB is a high-heat-dissipation printed circuit board designed for electronics with high-power components—such as LED lighting, power amplifiers, automotive inverters, and industrial power supplies. Unlike standard FR-4 PCBs (thermal conductivity ~0.3 W/m·K), ceramic substrates offer exceptional thermal conductivity (10-300 W/m·K), enabling efficient heat transfer from components to heat sinks, preventing overheating and extending device lifespan.

Its core is the ceramic substrate, with common materials including alumina (Al₂O₃, 15-30 W/m·K), aluminum nitride (AlN, 170-230 W/m·K), and silicon carbide (SiC, 270-300 W/m·K). Alumina is cost-effective for mid-power applications (e.g., LED drivers), while AlN and SiC suit high-power devices (e.g., EV inverters) due to superior heat dissipation. The substrate is bonded to a copper layer (100-500 μm thick) via direct bond copper (DBC) or active metal brazing (AMB) technology—DBC uses high temperatures (850-1050°C) to fuse copper to ceramic, creating a low-resistance thermal path.

Component mounting and trace design optimize heat flow. High-power components (e.g., MOSFETs, LEDs) are soldered directly to the thick copper layer, which acts as a heat spreader. Traces are wide and short to minimize thermal resistance, and vias (thermal vias) filled with copper connect top and bottom copper layers, enhancing vertical heat transfer. Some designs integrate heat sinks directly into the ceramic substrate (e.g., embedded aluminum fins) for passive cooling.

Testing focuses on thermal performance and durability. Thermal resistance (θjc) is measured via infrared thermography—must be <1°C/W for high-power use. The PCB undergoes thermal cycling (-55°C to 150°C for 1000 cycles) to check for substrate-copper delamination, as ceramic is brittle. Mechanical strength tests (bending, impact) ensure it withstands handling, though ceramic PCBs are often paired with metal housings for protection.

For applications like high-power LED streetlights or EV battery chargers, the Thermal Conductive Ceramic PCB prevents overheating—enabling reliable operation of heat-intensive electronics.