The Thermal Conductive Plastic PCB is a lightweight, cost-effective alternative to ceramic or metal-core PCBs, designed for low-to-mid power electronics needing moderate heat dissipation—such as consumer devices (e.g., smartphone chargers), automotive infotainment systems, and IoT sensors. It combines the flexibility of plastic substrates with thermal conductivity (1-20 W/m·K), higher than standard FR-4 (~0.3 W/m·K) but lower than ceramic, making it ideal for applications where weight and cost are priorities.

The substrate is a thermoplastic composite infused with conductive fillers—common fillers include carbon fibers (5-10 W/m·K), graphite (10-15 W/m·K), or metal particles (aluminum, copper, 15-20 W/m·K). Polyamide (PA) or polyphenylene sulfide (PPS) are base plastics, chosen for heat resistance (Tg >120°C) and chemical stability. The filler content (30-60% by weight) balances thermal conductivity and mechanical flexibility—higher filler levels boost conductivity but reduce flexibility.

Copper traces and component mounting are adapted for plastic. Traces are thin (35-70 μm) and applied via electroless copper plating or hot pressing, as plastic cannot withstand DBC temperatures. Adhesive-based copper foils (with acrylic or epoxy adhesives) are also used, though they add slight thermal resistance. Low-power components (e.g., ICs, resistors) are surface-mounted, and thermal vias (filled with conductive epoxy) improve heat transfer to the substrate.

Testing validates thermal and mechanical performance. Thermal conductivity is measured via laser flash analysis (LFA), ensuring it meets target values. The PCB undergoes heat aging (125°C for 1000 hours) to check for filler degradation or adhesive failure. Flexibility tests (bending to 90° for 100 cycles) confirm it withstands dynamic use (e.g., wearable devices). Electrical tests (insulation resistance, dielectric strength) ensure no filler-induced short circuits.

For applications like portable power banks or automotive interior lights, the Thermal Conductive Plastic PCB offers a lightweight, affordable solution—dissipating moderate heat without the cost of ceramic.