PCB boards with thickened copper foil offer enhanced electrical and mechanical properties, making them suitable for applications that require high current - carrying capacity, improved thermal conductivity, and greater durability. Copper foil is a key component of PCBs, serving as the conductive pathways for electrical signals and power.

The primary advantage of thickened copper foil is its ability to handle higher current levels. In applications such as power supplies, motor control circuits, and high - power amplifiers, a significant amount of electrical current needs to flow through the PCB traces. A thicker copper foil reduces the resistance of the traces, minimizing power losses and preventing excessive heating. For example, in a power supply PCB, thickened copper foil can ensure that the power - carrying traces can handle the high currents required to power multiple components without overheating or causing voltage drops.

In addition to improved current - carrying capacity, thickened copper foil also offers better thermal conductivity. As electrical current flows through the copper traces, heat is generated. A thicker copper layer can dissipate this heat more effectively, helping to maintain the operating temperature of the PCB within acceptable limits. This is especially important in applications where components generate a significant amount of heat, such as in high - performance processors and power - hungry integrated circuits.

From a mechanical perspective, thickened copper foil provides greater strength and durability to the PCB. The increased thickness of the copper layer makes the PCB more resistant to physical damage during handling, assembly, and operation. It can withstand the stresses associated with soldering, component insertion, and mechanical vibrations better than PCBs with standard - thickness copper foil.

The process of thickening the copper foil on PCBs typically involves electroplating. After the initial copper foil is laminated onto the PCB substrate, additional copper is deposited onto the traces and pads through an electroplating process. The thickness of the copper can be precisely controlled by adjusting the plating time, current density, and other electroplating parameters. However, thickening the copper foil also increases the cost and manufacturing time of the PCB. Therefore, the decision to use thickened copper foil is often based on the specific requirements of the application, balancing the need for enhanced performance with cost - effectiveness.