Time:2025-08-26 Views:1
The Multilayer Power PCB is a complex printed circuit board with multiple layers (4-20+) dedicated to power distribution and management, designed for electronics with high current demands and multiple voltage rails—such as servers, EV battery management systems (BMS), industrial PLCs, and medical imaging equipment. Unlike standard single/double-layer PCBs, it separates power and signal layers, reducing EMI and enabling efficient distribution of high currents (10-100+ A) and multiple voltages (e.g., 12V, 5V, 3.3V).
Layer stackup is optimized for power flow. Typical stacks include: power layers (copper planes, 70-350 μm thick) for high-current distribution, ground layers (adjacent to power layers to form a low-impedance power loop), and signal layers (thin copper, 35-70 μm) for data transmission. Power layers use wide, solid copper planes (instead of traces) to minimize resistance—for example, a 100 μm thick copper plane can carry 50A with <1°C temperature rise. Layer bonding uses high-Tg FR-4 prepreg (Tg >170°C) to withstand heat from high currents.
Power integrity features prevent voltage drop and EMI. Decoupling capacitors are placed close to IC power pins on signal layers, connected via vias to power/ground planes, to suppress voltage fluctuations. Power vias (large, 0.5-1 mm, filled with copper) connect power layers, ensuring low-resistance current flow. Ground planes act as shields between power and signal layers, reducing EMI—critical for sensitive components (e.g., sensors in medical equipment).
Testing ensures power delivery and reliability. Current-carrying capacity is tested via thermal imaging—temperature rise <30°C at maximum current. Voltage drop across power planes is measured—must be <5% of the supply voltage. Thermal cycling (-40°C to 125°C for 1000 cycles) checks for layer delamination, as high currents generate heat. EMI tests (per CISPR 22) ensure power layers do not emit interference.
For server power supplies or EV BMS, the Multilayer Power PCB efficiently distributes high currents and multiple voltages—enabling stable operation of power-hungry electronics.