High-precision stamping processing technology is a critical manufacturing step for rigid printed circuit boards (PCBs), used to create holes, slots, cutouts, and edge profiles in the PCB substrate with extreme accuracy. This technology is essential for PCBs used in high-density electronic devices such as smartphones, medical equipment, and aerospace components, where component placement tolerances are as tight as ±0.05 mm. Unlike traditional drilling (which is slow for large-volume production) or laser cutting (which can cause thermal damage to the PCB), high-precision stamping offers high speed, low cost, and minimal material waste, making it ideal for mass-produced rigid PCBs. The process involves using a custom-designed stamping die (a pair of male and female tools) to press the PCB substrate, shearing or punching the material into the desired shape with precision.

The key components of high-precision stamping for rigid PCBs include the stamping die, press machine, and PCB substrate preparation. The stamping die is the most critical element, as its precision directly determines the accuracy of the stamped features. Dies are typically made of high-hardness materials such as tungsten carbide (HRC 85-90) or high-speed steel (HSS, HRC 60-65) to withstand the high pressure of stamping (50-200 kg/cm²) and maintain sharp edges for 100,000+ stamping cycles. The die’s design includes features such as punch tips (for holes), shear edges (for slots), and guide pins (to align the PCB substrate during stamping). The punch tip diameter tolerance is ±0.005 mm for micro-holes (0.1-0.5 mm diameter), ensuring that the stamped holes match the required size for component leads or vias. Additionally, the die may include a stripper plate to hold the PCB substrate in place during stamping and prevent it from sticking to the punch, ensuring consistent results.