The High-Frequency Laminate PCB (often called high-frequency PCB) is engineered for signal transmission at high frequencies (1 GHz to 100+ GHz)—critical for telecommunications (5G base stations, satellite communication), radar systems, and high-speed data equipment (e.g., fiber optic transceivers). Standard FR-4 PCBs suffer from high dielectric loss (Df >0.02) at high frequencies, causing signal attenuation; high-frequency laminates minimize loss with low Df (<0.005) and stable dielectric constant (Dk, 2.2-4.5).

The core is a specialized laminate material. Common options include PTFE (Teflon, Dk 2.1-2.3, Df <0.002), hydrocarbon ceramic (HC, Dk 3.0-3.5, Df <0.004), and liquid crystal polymer (LCP, Dk 2.9-3.1, Df <0.003). PTFE is ideal for ultra-high frequencies (50+ GHz, e.g., satellite radar) due to minimal loss, but it is expensive and requires specialized processing (e.g., plasma treatment for copper bonding). HC laminates balance performance and cost for 5G (3.5-6 GHz) applications, while LCP offers flexibility for wearable high-frequency devices (e.g., RFID tags).

Trace design and manufacturing ensure signal integrity. Traces use controlled impedance (50Ω or 75Ω) to match the source/destination, preventing signal reflection. They are plated with thin gold (0.1-0.5 μm) or silver (0.5-1 μm) to reduce skin effect loss—high frequencies travel along trace surfaces, so conductive plating minimizes resistance. Vias are small (0.1-0.3 mm) and filled with copper to avoid signal discontinuity, and solder masks are low-loss (e.g., polyimide) to not disrupt Dk.

Testing focuses on high-frequency performance. Insertion loss (signal loss through traces) is measured via vector network analyzer (VNA)—must be <0.5 dB/inch at 10 GHz. Phase stability (Dk variation with temperature) is tested over -40°C to 85°C—Dk change <1% is required. Signal integrity tests (eye diagram analysis) verify no distortion in high-speed data transmission (e.g., 10 Gbps).

For 5G base station antennas or aerospace radar systems, the High-Frequency Laminate PCB ensures clear, low-loss signal transmission—critical for high-speed, long-range communication.