I. Service Capabilities

　　A. PCB Design

　　High-precision layout: In view of the increasing miniaturization and integration of consumer electronic devices, service providers need to have strong PCB design capabilities. When designing electronic products equipped with CNC heat sinks, the positions of various components should be accurately planned. For example, chips with high heat generation should be placed as close to the CNC heat sink as possible to shorten the heat conduction path and improve heat dissipation efficiency. Taking smartphones as an example, the distance between key heat sources such as processors and CNC heat sinks must be precisely controlled within a very small range, generally in the order of millimeters, to ensure that heat can be quickly transferred to the heat sink.

　　Signal integrity optimization: The signal transmission speed in consumer electronic products continues to increase, and high-speed signals have extremely high requirements for PCB wiring. Service providers should use reasonable wiring strategies, such as using differential line pairs to transmit high-speed signals, control parameters such as routing length, line width, and line spacing, and reduce signal reflection and crosstalk. When designing PCBs for VR devices, the high-speed data lines connecting the display screen and the main control chip must be routed strictly in accordance with the impedance matching principle to ensure signal integrity and avoid problems such as image display jamming and screen distortion, which is crucial to improving user experience.

　　Heat dissipation design collaboration: Closely collaborate with CNC heat sink design to reserve appropriate heat dissipation channels and mounting holes on the PCB. For laptops using large-area CNC heat sinks, PCB design should consider how to guide air to flow between the heat sink and the PCB to improve the convection heat dissipation effect. At the same time, by laying a large area of copper foil on the PCB, the heat conduction area is increased and the heat is evenly dispersed on the CNC heat sink.

　　B. PCB manufacturing

　　Advanced manufacturing process: With high-precision manufacturing equipment and processes, it is possible to produce high-layer, fine-line PCBs. For example, laser drilling technology is used to achieve micro-hole processing, and the hole diameter can be as small as tens of microns, meeting the needs of high-density interconnection of consumer electronic products. When manufacturing PCBs for high-end smart watches, the fine line manufacturing process is used to achieve a line width/line spacing of 50μm/50μm or even smaller, integrating more functional modules in a limited space.

　　Material selection and application: Select appropriate PCB materials according to different usage scenarios and performance requirements of consumer electronics. For products that require good heat dissipation performance, materials with high thermal conductivity, such as ceramic-filled epoxy resin substrates, can be used. Their thermal conductivity is higher than that of ordinary FR-4 materials, which can better assist CNC heat sinks in heat dissipation. At the same time, in some electronic products with high requirements for electromagnetic compatibility, materials with shielding functions are used to reduce the impact of electromagnetic interference on equipment performance.

　　Strict quality control: During the PCB manufacturing process, a strict quality inspection process is implemented. Through automatic optical inspection (AOI), flying probe testing and other means, the PCB's line conductivity, short circuit and open circuit conditions, appearance defects, etc. are fully inspected. When mass-producing PCBs for tablets, 100% AOI inspection is performed on each PCB to ensure that the product quality meets high standards and reduce the defective rate in the subsequent PCBA assembly process.

　　C. PCBA assembly

　　SMT patch technology: SMT (Surface Mount Technology) patch equipment with high speed and high precision can achieve precise placement of tiny components. When assembling PCBA for Bluetooth headsets, components such as resistors and capacitors with a size of only 0201 or even smaller can be accurately mounted on the PCB, with a mounting accuracy of ±0.05mm or less. At the same time, advanced reflow soldering technology is used to accurately control the soldering temperature curve to ensure reliable solder joint quality and avoid problems such as cold soldering and continuous soldering.

　　Plug-in and welding: For some components that require plug-in, such as high-power inductors and connectors, professional plug-in equipment and skilled operators are available. During the plug-in process, ensure good contact between the component pins and the PCB pads, and achieve reliable electrical connection through wave soldering or manual soldering. When assembling the PCBA of the desktop computer power supply, strict welding quality control is performed on the plug-in components to ensure the stability and reliability of the power supply when running at high power.

　　Testing and debugging: After the PCBA is assembled, comprehensive testing and debugging are carried out. Including functional testing, simulating the actual working scene of electronic products to detect whether their various functions are normal; electrical performance testing, measuring whether the power supply voltage, current, signal strength and other parameters meet the design requirements; compatibility testing, ensuring the compatibility of the product with other devices or accessories. For the PCBA of game consoles equipped with CNC heat sinks, a strict testing process is used to ensure that the equipment can work stably under long-term high-load operation, give full play to the heat dissipation advantages of CNC heat sinks, and avoid performance degradation or system crashes caused by overheating.

　　II. Industry experience and cases

　　A. Deep cultivation in the field of consumer electronics

　　Rich product line coverage: We have accumulated many years of experience in the field of consumer electronics and have served many well-known brands. From common devices such as mobile phones, tablets, and laptops to diversified products such as smart wearable devices, smart home products, and game consoles, there are successful PCB PCBA service cases. For example, we provide PCB design and PCBA assembly services for a well-known brand of smart bracelets, helping them to achieve a lightweight design while ensuring good heat dissipation performance and battery life. The smart bracelet has achieved great success in the market and continues to lead in sales.

　　A keen grasp of industry trends: With the rapid development of technology in the consumer electronics industry, such as the popularization of 5G communication technology, the application of artificial intelligence, and the innovation of product appearance design, we can adjust service strategies in a timely manner. In the PCB design of 5G mobile phones, the high-speed signal transmission requirements and heat dissipation requirements of 5G chips are fully considered. By optimizing the PCB layout and selecting suitable heat dissipation materials, combined with the design of CNC heat sinks, the problem of high heat generation of 5G mobile phones is effectively solved, and the performance and stability of mobile phones are improved.

　　B. CNC heat sink related cases

　　High-performance computer heat dissipation solutions: Provide PCB PCBA services for high-end gaming computer manufacturers. Aiming at the characteristics of high heat generation of core components such as CPU and GPU of gaming computers, we jointly design efficient heat dissipation solutions with customers. In PCB design, the layout of power lines and signal lines is optimized to reduce the heat generated by line loss; when assembling PCBA, the CNC heat sink is accurately installed to ensure that it fits tightly with the heating components. Through these measures, when the gaming computer runs large 3D games for a long time, the CPU and GPU temperatures are always kept within a reasonable range, the performance is stable, and the frame rate is smooth, meeting the needs of gamers for high-performance computers.

　　Smart projector heat dissipation coordination: When providing PCB PCBA services for smart projectors, the compact internal space of the projector is taken into consideration, and the heat dissipation problem is prominent. By rationally laying out the heat dissipation copper foil and heat dissipation channels on the PCB, and working in conjunction with the external CNC heat sink, the heat generated by the projector bulb and chip can be effectively dissipated. At the same time, during the PCBA assembly process, each component is strictly inspected and debugged to ensure that the projector will not have problems such as picture distortion and brightness reduction due to overheating during long-term use, thereby improving the reliability of the product and user experience.

　　III. Supply Chain Management and Cost Control

　　A. Supply Chain Integration

　　High-quality supplier resources: With a broad and stable supplier network, we have established long-term cooperative relationships with world-renowned electronic component suppliers. We can ensure that high-quality and stable supply of raw materials and components are obtained during PCB manufacturing and PCBA assembly. For example, when purchasing copper clad laminates for high-end smartphone PCBs, we cooperate with world-class copper clad laminate suppliers to ensure that the performance and quality of the materials meet strict industry standards, and at the same time, obtain competitive prices through bulk purchases and long-term cooperation agreements.

　　Supply chain collaborative management: Through the information system, we can achieve real-time data interaction with suppliers, and collaboratively manage the procurement, inventory, and production progress of raw materials. When providing customized PCB PCBA services to customers, we can quickly coordinate with suppliers to arrange production and supply according to customer order requirements, shortening the product delivery cycle. In a new tablet computer project, through supply chain collaborative management, the delivery cycle that originally took several months was shortened to several weeks, helping customers quickly seize the market opportunity.

　　B. Cost control strategy

　　Optimize design to reduce costs: In the PCB design stage, reduce manufacturing costs by optimizing circuit layout, reducing the number of components, and selecting cost-effective materials. When designing the PCB of an ordinary home smart speaker, through reasonable circuit design, unnecessary functional modules are reduced, and suitable general components are selected. Under the premise of not affecting product performance, the manufacturing cost of PCB and the assembly cost of PCBA are effectively reduced.

　　Production process optimization: Continuously optimize the production process of PCB manufacturing and PCBA assembly, improve production efficiency, and reduce production costs. Introduce advanced automated production equipment to reduce manual operation links and improve production accuracy and consistency. On the SMT patch production line, high-speed patch machines and intelligent material distribution systems are used to greatly improve the speed and accuracy of patch placement, and reduce labor costs and material loss costs.

　　Cost monitoring and analysis: Establish a complete cost monitoring system to calculate and analyze the costs of each link of PCB PCBA services. Regularly evaluate the raw material procurement costs, production costs, logistics costs, etc., promptly identify the reasons for cost fluctuations and take corresponding measures to adjust. Through cost monitoring and analysis, we can provide customers with reasonable quotation solutions while ensuring that we maintain our cost advantage in market competition.