The Anti-Oxidation PCB is engineered to prevent oxidation of copper traces and component leads— a common issue in high-temperature, high-humidity, or oxygen-rich environments (e.g., automotive under-hood systems, industrial ovens, and aerospace electronics). Oxidation forms a non-conductive oxide layer on copper (CuO or Cu₂O), increasing trace resistance and causing intermittent connections or complete failure. This PCB uses specialized plating, coatings, and materials to block oxygen exposure, ensuring long-term conductivity.

The primary defense against oxidation is trace plating. Copper traces are plated with metals that form a stable, non-oxidizing barrier. ENIG is widely used: nickel (5-15 μm) bonds tightly to copper, preventing oxygen from reaching it, while gold (0.1-0.5 μm) is inert and resists oxidation even at high temperatures (up to 150°C). For higher temperatures (e.g., 200°C in automotive engines), nickel-palladium-gold (NiPdAu) plating is used—palladium (0.1-0.3 μm) adds extra oxidation resistance. Some designs use tin-silver (SnAg) plating with a thin organic solderability preservative (OSP) layer, which acts as a temporary oxygen barrier for low-temperature applications (e.g., consumer electronics).

Substrate and solder mask materials also contribute. The PCB substrate uses high-Tg FR-4 (Tg >170°C) or polyimide (for flexible PCBs), which have low oxygen permeability. The solder mask is a dense epoxy or polyimide layer (30-60 μm thick) with no pinholes, covering traces to block oxygen. For flexible anti-oxidation PCBs (used in wearable devices), a thin metal foil (e.g., aluminum) is laminated to the substrate as an oxygen barrier, though this adds minimal thickness.

Testing verifies oxidation resistance. The PCB is exposed to high-temperature oxidation tests (150°C in air for 1000 hours) or humidity-oxidation cycling (85°C, 85% RH + 125°C dry heat, 100 cycles). After testing, traces are inspected under a microscope for oxide formation (none allowed) and electrical resistance is measured—must stay <5% above initial values. Solder joint oxidation is checked via shear strength tests (no >10% strength loss).

Whether used in an EV’s battery management system or an industrial heater controller, the Anti-Oxidation PCB maintains conductivity—preventing oxide buildup that degrades standard PCBs.