I. Core Service Capabilities and Process Analysis

　　1. 24-Hour Delivery Guarantee

　　Full Process Timeline Breakdown:

　　Order Confirmation (within 1 hour): Supports online BOM import and rapid DFM (Design for Manufacturability) review. The system automatically matches component inventory to avoid production delays due to design issues.

　　Material Procurement (4-8 hours): Relying on a global component supply chain system (cooperating with 1000+ original manufacturers/authorized distributors), the inventory coverage rate of commonly used resistors, capacitors, inductors, ICs, etc., is ≥95%. Emergency restocking channels can be activated for small batches of scarce materials.

　　Production (10-12 hours): Utilizes a high-speed SMT placement line (placement accuracy ±0.03mm), supporting soldering of complex components such as 01005 ultra-small packages and BGA/QFP. Combined with automated AOI inspection, small batches of up to 500 pieces can achieve continuous operation of "placement-soldering-initial testing".

　　Quality Inspection and Delivery (2-4 hours): Covers X-Ray inspection (BGA solder joint inspection), ICT online testing (circuit continuity/parameter verification), and functional testing (customized test fixtures as needed). Qualified products are delivered via SF Express/JD.com air express, ensuring delivery to major cities nationwide within 24 hours.

　　Service Scope:

　　Sample Orders: 1-10 pieces, supporting rapid design verification, providing a full-process service of "SMT + Through-hole + Functional Testing".

　　Small Batch Orders: 10-500 pieces, suitable for product trial production and market verification stages, supporting flexible adjustment of production quantity, with no minimum order quantity limit.

　　Applicable PCB Specifications: Maximum board thickness 6mm, minimum board thickness 0.4mm, board area ≤500mm×500mm, 2-12 layers (4 layers and below standard boards are delivered within 24 hours; 6 layers and above require prior confirmation of process cycle).

　　2. Technical Capabilities and Process Support

　　SMT Process Parameters:

　　Placement Speed: Up to 60,000 points/hour, supports 01005 (0.4mm×0.2mm) and 0201 packaged components, BGA minimum pitch 0.4mm, QFP minimum lead pitch 0.3mm.

　　Soldering Process: Lead-free reflow soldering (RoHS 2.0 compliant), supports selective wave soldering (for through-hole devices), high-temperature devices can have customized soldering temperature profiles (maximum temperature resistance 300℃).

　　Special Processes: Supports irregularly shaped component placement (e.g., connectors, sensors), adhesive reinforcement (for vibration resistance), conformal coating (three-proof coating, suitable for humid/dusty environments). Process requirements must be specified in the order in advance.

　　Design Support Services:

　　Free DFM Review: During the order confirmation stage, engineers will provide optimization suggestions for PCB layout (such as heat dissipation paths, component spacing), package library matching, stencil design, etc., reducing production defect rates (average DFM issue rectification rate ≥90%).

　　Customized Test Solutions: Based on the product functional requirements provided by the customer, we design simple test fixtures (such as probe-type test fixtures) and write test process documents to ensure that delivered products can be directly used for subsequent assembly.

　　II. Applicable Scenarios and Industry Adaptation

　　1. Electronic R&D Enterprises (Sample Verification Scenarios)

　　Core Needs: Quickly verify the feasibility of circuit designs and shorten the R&D cycle.

　　Service Adaptation: Supports expedited production of 1-5 samples, with delivery within 24 hours, accelerating the "design-test-iteration" cycle, especially suitable for prototype development in fields such as IoT modules (such as Wi-Fi/Bluetooth modules), industrial control boards (sensor acquisition cards), and consumer electronics (small smart devices).

　　Added Value: Provides soldering defect analysis reports to help engineers locate design problems (such as cold solder joints, component compatibility issues) and provide optimization solutions.

　　2. Startups (Small-Batch Pilot Production Scenario)

　　Core Need: Low-cost product pilot production and rapid market launch to validate demand.

　　Service Adaptation: No minimum order quantity for small-batch orders of 10-100 pieces, eliminating high mold opening costs. Production quantity can be adjusted according to actual needs, reducing capital occupation costs. Suitable for small-batch pilot production in fields such as smart hardware (e.g., smart home controllers), medical equipment (portable testing instruments), and automotive electronics (vehicle auxiliary modules).

　　Supply Chain Support: Assistance in managing component inventory. Long-term supply chain planning is provided for mass production needs after pilot production, ensuring stable material supply.

　　3. Emergency Repair/Replacement Scenario (Industrial/Medical Fields)

　　Core Need: Rapid replenishment of PCBA parts for faulty equipment, reducing downtime losses.

　　Service Adaptation: For damaged PCBAs in industrial control cabinets, medical instruments, etc., an emergency service of "reverse engineering - replication production - functional matching" is provided, delivering replacement parts within 24 hours. Suitable for emergency repairs on manufacturing production lines and emergency replenishment of hospital equipment.

　　Quality Assurance: Replica products are manufactured strictly according to the original board parameters. Key components use the same brand/model, and the functional test pass rate is ≥99%, ensuring compatibility with the original equipment.

　　III. Key Aspects of Cooperation and Quality Control

　　1. Cooperation Process and Order Integration

　　Order Initiation: Upload the BOM list (Excel format), Gerber file (PCB production file), and coordinate file (SMT placement position) via the official website/mini-program. The system automatically generates a quotation (within 10 minutes). After confirming the quotation, a prepayment (50%) is made to start production.

　　Progress Tracking: Customers can view the production progress (material procurement status, SMT production stage, test results) in real time through the order system. Key milestones (such as material availability, production completion) will be notified simultaneously via SMS/email.

　　After-Sales Support: Within 7 days of delivery, if non-human-caused soldering defects or functional failures occur, rework or re-production will be provided free of charge. A 3-month warranty period is provided; free repair services will be provided for process issues during the warranty period.

　　2. Quality Control System

　　Inspection Standards:

　　* **Incoming Quality Control (IQC):** Visual inspection and parameter testing of components (e.g., capacitor values, resistor values) to ensure materials meet specifications and prevent counterfeit or substandard products.

　　* **In-Process Quality Control (IPQC):** Samples are taken every 2 hours during SMT production for AOI inspection, focusing on solder joint appearance (e.g., bridging, cold solder joints, insufficient solder). If the defect rate exceeds 0.5%, production is immediately stopped and the process adjusted.

　　* **Final Quality Control (FQC):** 100% of finished products undergo ICT testing (detecting circuit continuity, short circuits, and incorrect/missing components). Functional test coverage is ≥95% (based on customer-provided testing standards). X-ray inspection is performed on 100% of BGA/QFP components (10% sampling rate, full inspection for abnormalities).

　　Certifications and Qualifications: ISO 9001 Quality Management System Certification and ISO 13485 Medical Device Quality Management System Certification (for medical field orders). Products comply with RoHS 2.0, REACH, and other environmental standards; corresponding certification reports are available.

　　3. Cost and Delivery Optimization Recommendations

　　Cost Control:

　　Material Selection: Prioritize commonly used components with sufficient inventory, avoiding the use of scarce/customized components in small batches (which increases procurement costs and lead time). Engineers can provide alternative material recommendations (with consistent performance and lower costs).

　　PCB Design: Simplify board types (avoid irregularly shaped boards), reduce special processes (such as blind/buried vias, thick copper). 4-layer boards cost less than 6-layer boards, reducing overall foundry costs.

　　Delivery Efficiency:

　　Prepare Documents in Advance: Ensure the BOM list format is standardized (including material type, specifications, quantity, and package), and that Gerber files are complete (including Top/Bottom layers, silkscreen, solder mask, and stencil files) to avoid delays in review due to document issues.

　　Choose the nearest delivery option: 24-hour door-to-door pickup or express air delivery is supported in major cities across the country (such as Beijing, Shanghai, Guangzhou, Shenzhen, Suzhou, and Chengdu). For remote areas, the "next-day delivery after production" service can be selected to ensure controllable delivery time.