PCBA reliability testing subjects assemblies to environmental and mechanical stresses to predict lifespan and failure modes. Thermal cycling (-40°C to 125°C, 1,000 cycles) identifies solder joint cracks in automotive IGBTs, where temperature swings cause CTE mismatch between PCB (17ppm/°C) and compo
Dec 13, 2025
1

PCBA in-line inspection integrates automated optical inspection (AOI), 3D solder paste inspection (SPI), and X-ray to detect defects early in manufacturing. AOI systems use high-resolution cameras (5μm resolution) to check component placement, polarity, and solder joint quality at 0.3 seconds per bo
Dec 13, 2025
1

PCBA debugging and validation resolve functional discrepancies by combining root-cause analysis, signal tracing, and firmware adjustments. Boundary scan (JTAG) tests embedded processors in smartphones, isolating faults in 10 minutes vs. 2 hours with manual probing. Oscilloscopes with 16GHz bandwidth
Dec 13, 2025
1

PCBA Quality Control (QC) is a systematic process the entire lifecycle of Printed Circuit Board Assemblies—from design and component sourcing to manufacturing, testing, and shipping—aimed at ensuring that PCBAs meet predefined quality standards, performance requirements, and regulatory compliance.
Dec 12, 2025
1

PCBA Failure Analysis is a systematic investigative process used to identify the root cause of Printed Circuit Board Assembly failures—whether they occur during manufacturing (e.g., solder joint defects), testing (e.g., environmental test failures), or field use (e.g., customer-reported malfunctions
Dec 12, 2025
1

A PCBA Test Fixture (also called a PCBA Test Jig) is a custom-designed tool used to securely hold, position, and connect Printed Circuit Board Assemblies during testing—enabling efficient, consistent, and accurate electrical or functional testing of PCBAs in manufacturing or repair processes. Unlike
Dec 12, 2025
1

AOI PCBA Inspection (Automated Optical Inspection for Printed Circuit Board Assemblies) is a specialized machine vision technology focused on verifying the quality of PCBAs by automatically identifying defects in components, soldering, and board layout. As a critical step in electronics manufacturin
Dec 11, 2025
1

X-Ray PCBA Inspection is a non-destructive testing (NDT) technology that uses X-ray radiation to visualize internal and hidden defects in Printed Circuit Board Assemblies (PCBAs)—defects that are invisible to traditional optical inspection methods (like AOI). Unlike AOI, which relies on visible ligh
Dec 11, 2025
1

PCBA Aging Test (also called PCBA burn-in test) is a reliability testing process designed to expose Printed Circuit Board Assemblies (PCBAs) to controlled environmental stress (e.g., high temperature, high humidity, electrical load) for an extended period—accelerating the failure of weak components
Dec 11, 2025
1

I. Core of High-Precision Technology: Signal Integrity & Industrial Reliability 1. Lead-Free Solder Systems for Industrial Stability Mainstream High-Precision Industrial Solution: Sn-3.0Ag-0.5Cu-0.1Ni-0.05Ge alloy, optimized for precision signal interconnection (≤1μs response time), maintains le
Dec 10, 2025
1

I. Core of Multi-Layer Technology: High-Density Integration & Vehicle-Grade Reliability 1. Lead-Free Solder Systems for Automotive Durability Mainstream Multi-Layer Automotive Solution: Sn-3.0Ag-0.5Cu-0.1Ni-0.05Ge alloy, optimized for 8~24-layer PCB interconnection, maintains lead content below
Dec 10, 2025
1

I. Core of Medical-Grade Technology: Biocompatibility & Diagnostic Precision Adaptation 1. Lead-Free Solder Systems for Medical Reliability Mainstream Medical-Grade Solution: Sn-3.0Ag-0.5Cu-0.05Ni-0.03Ge alloy, optimized for long-term stable operation (≥10 years), maintains lead content below 50
Dec 10, 2025
1

I. Core of Rapid-Prototype Technology: Fast-Adaptive Innovation & Efficient Process 1. Lead-Free Solder Systems for Prototype Compatibility Mainstream Rapid-Prototype Solution: SAC305 (Sn96.5%/Ag3.0%/Cu0.5%) alloy, optimized for fast assembly (24-hour turnaround), maintains lead content below 50
Dec 10, 2025
1

I. Core of High-Temperature Technology: Heat-Resistant Innovation & Process Optimization 1. Lead-Free Solder Systems for High-Temperature Stability Mainstream High-Temp Solution: Sn-3.0Ag-0.5Cu-0.1Ni-0.05Ge alloy, optimized for continuous 125℃ operation, maintains lead content below 50ppm (EU Ro
Dec 10, 2025
1

I. Core of Customized Technology: Scenario-Adaptive Innovation & Process Optimization 1. Lead-Free Solder Systems for Smart Home Compatibility Mainstream Customization Solution: Sn-0.7Cu-0.3Ag (Sn99.0%/Cu0.7%/Ag0.3%) alloy, balanced for cost and reliability, maintains lead content below 50ppm (E
Dec 10, 2025
1
