Simply put, the PCBA process combines the SMT assembly process and the DIP assembly process. Depending on different production technical requirements, it can be categorized into single-sided SMT assembly, single-sided DIP assembly, single-sided mixed assembly, single-sided SMT and DIP mixed assembly, double-sided SMT assembly, and double-sided mixed assembly, among others.

The PCBA process involves steps such as loading the board, solder paste printing, component placement, reflow soldering, component insertion, wave soldering, testing, and quality inspection.

Different types of PCB boards involve varied process flows. The distinctions for various scenarios are elaborated in detail below.

1. Single-Sided SMT Assembly
   Solder paste is applied to the component pads. After solder paste printing on the bare PCB board, the relevant electronic components are placed and then soldered via reflow soldering.

2. Single-Sided DIP Assembly
   After production line workers insert electronic components into the PCB board requiring through-hole assembly, the board undergoes wave soldering for fixation. This is followed by lead trimming and board cleaning. However, wave soldering has relatively low production efficiency.

3. Single-Sided Mixed Assembly
   The PCB board undergoes solder paste printing, component placement, and fixation through reflow soldering. After quality inspection, DIP assembly is performed, followed by wave soldering or manual soldering. If through-hole components are few, manual soldering is recommended.

4. Single-Sided Mixed SMT and DIP Assembly
   Some PCB boards are double-sided, with one side for SMT assembly and the other for DIP assembly. The assembly processes for SMT and DIP are the same as single-sided processing, but fixtures are required when the PCB board undergoes reflow soldering and wave soldering.

5. Double-Sided SMT Assembly
   To ensure both aesthetics and functionality of the PCB board, some designers adopt double-sided SMT assembly. IC components are placed on side A, while chip components are mounted on side B. This fully utilizes the PCB board space, minimizing its area.

6. Double-Sided Mixed Assembly
   There are two methods for double-sided mixed assembly. The first method involves three heating cycles during PCBA assembly, resulting in low efficiency. Additionally, the use of the red glue process in wave soldering leads to low qualification rates and is not recommended. The second method is suitable when there are many double-sided SMD components and very few THT components, in which case manual soldering is advised. If THT components are numerous, wave soldering is recommended.

The above is a simplified overview of the PCBA assembly process for printed circuit boards, presented with text and graphics to illustrate the process flow. However, as PCBA assembly and production processes are gradually optimized, the defect rate continues to decrease, ensuring the production of high-quality finished products. The quality of all solder joints for the electronic components mentioned above determines the quality of the PCBA board. Therefore, when seeking PCBA assembly manufacturers, relevant electronics companies are advised to look for those with extensive experience and advanced processing equipment.