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Visit from American partners

Visit from American partners

Visit from American partnersDec 03, 2025 Visit from American partners1

With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

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Impedance Control Failure: The High-Speed Signal Trap in 8-Layer PCBs

Impedance Control Failure: The High-Speed Signal Trap in 8-Layer PCBs

Engineers who have worked on high-density 8-layer PCBs understand that impedance is the "lifeline" in high-speed signal design. This is especially true for 8-layer boards, which carry high-frequency signals such as 6G R&D, high-speed communications, and industrial control systems. Even the slightest

Impedance Control Failure: The High-Speed Signal Trap in 8-Layer PCBsMar 23, 2026 Impedance Control Failure: The High-Speed Signal Trap in 8-Layer PCBs506

DetailImpedance Control Failure: The High-Speed Signal Trap in 8-Layer PCBs

High-Precision PCB Solder Mask Printing Challenges: Manual Process Shortcomings and Automated Printing Technology Breakthroughs

High-Precision PCB Solder Mask Printing Challenges: Manual Process Shortcomings and Automated Printing Technology Breakthroughs

Q: What new requirements do high-precision PCBs now impose on solder mask printing?A: With the advancement of 5G, automotive radar, and industrial control equipment, high-precision PCBs are trending towards high density, fine traces, smaller characters, and thin substrates. Consequently, solder mask

High-Precision PCB Solder Mask Printing Challenges: Manual Process Shortcomings and Automated Printing Technology BreakthroughsMar 21, 2026 High-Precision PCB Solder Mask Printing Challenges: Manual Process Shortcomings and Automated Printing Technology Breakthroughs41

DetailHigh-Precision PCB Solder Mask Printing Challenges: Manual Process Shortcomings and Automated Printing Technology Breakthroughs

Engineer's Must-Know PCB Shielding Material Pitfalls and New Trends

Engineer's Must-Know PCB Shielding Material Pitfalls and New Trends

Having worked in hardware for so many years, I've seen countless engineers choose the right shielding material, only to fail in electromagnetic compatibility (EMC) testing, damage the PCB, or experience shielding failure due to incorrect application. Let me share 10 high-frequency pitfalls—each one

Engineer's Must-Know PCB Shielding Material Pitfalls and New TrendsMar 20, 2026 Engineer's Must-Know PCB Shielding Material Pitfalls and New Trends17

DetailEngineer's Must-Know PCB Shielding Material Pitfalls and New Trends

Common PCB BGA Soldering Defects and Precision X-Ray Inspection Criteria

Common PCB BGA Soldering Defects and Precision X-Ray Inspection Criteria

Many electronic R&D engineers and PCB manufacturing practitioners have encountered similar frustrations: BGA chips appear flat and intact after soldering, but the assembled device frequently experiences crashes, signal instability, or functional failures. Only upon removing the chip for inspection a

Common PCB BGA Soldering Defects and Precision X-Ray Inspection CriteriaMar 19, 2026 Common PCB BGA Soldering Defects and Precision X-Ray Inspection Criteria363

DetailCommon PCB BGA Soldering Defects and Precision X-Ray Inspection Criteria

In-Depth Analysis of PCB Circuit Boards and Four-Layer Board Design

In-Depth Analysis of PCB Circuit Boards and Four-Layer Board Design

In electronic product R&D, a PCB circuit board is not merely a carrier for components; it is a critical infrastructure that determines signal integrity, power supply stability, manufacturing yield, assembly efficiency, and delivery timelines. For hardware teams, the success of a prototype verificati

In-Depth Analysis of PCB Circuit Boards and Four-Layer Board DesignMar 18, 2026 In-Depth Analysis of PCB Circuit Boards and Four-Layer Board Design1

DetailIn-Depth Analysis of PCB Circuit Boards and Four-Layer Board Design

High-frequency, high-speed multilayer PCB power integrity control

High-frequency, high-speed multilayer PCB power integrity control

With the widespread adoption of technologies such as 5G communications, artificial intelligence, and high-speed storage, the operating frequencies of electronic devices continue to rise. Chip clock frequencies have advanced from the MHz range to the GHz range, making high-frequency and high-speed sc

High-frequency, high-speed multilayer PCB power integrity controlMar 17, 2026 High-frequency, high-speed multilayer PCB power integrity control1

DetailHigh-frequency, high-speed multilayer PCB power integrity control
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